The heat transfer principle of thermal conductive silicone film and why thermal conductive silicone film is used

The existence of thermal conductive silicone film is mainly not for direct heat dissipation. Heat dissipation requires a heat sink to complete. When the heat source is connected to the heat sink, there will be a certain contact thermal resistance due to irregularities such as roughness and flatness of the contact area. Contact thermal resistance is generated due to heat transfer, which will make the thermal conduction channel not smooth, resulting in excessive heat accumulation on the contact surface and inability to quickly and effectively conduct to the surface of the heat sink or shell. Therefore, if thermal conductive silicone film is not used to fill it, it is difficult to achieve effective cooling. Not using thermal conductive silicone film can even cause the product to overheat instantly during thermal shock, leading to product crashes and reducing product life. At the same time, air is a poor conductor of heat. If the space between contact surfaces is too large or there is a gap, it will have a significant impact on heat dissipation. The thermal conductive silicone sheet is solid and soft, The compression performance is good, and it is not easy to deform. It can fill the contact area well, so that all poor conductors on the contact surface are discharged. Therefore, thermal conductive silicone sheets are basically used in various industries in the electronics industry where heat dissipation is required.