Thermal Conductive Silicone Sheet ND-1400

Category:Thermal conductive silicone sheet

The ND-TP1400 series of thermal conductive gap filling materials are used to fill the air gaps between heat-generating components and heat dissipation fins or metal bases. Their flexibility and elasticity make them highly suitable for coating various surfaces. Heat can be transferred to metal enclosures, heat dissipation plates, and even printed circuit boards (PCBs), thereby enhancing the efficiency and service life of heat-generating electronic components.
  • Details

Performance and Characteristics:

  • Thermal conductivity: 14.00 W/m·K

  • Ultra-high ceramic filling amount (non-metallic) gasket,

  • High thermal conductivity, high insulation, ultra-high withstand voltage

  • Low oil seepage rate, high reliability,

  • High compression and resilience,

  • Soft and self-adhesive

  • Easy to construct


Product Configuration:

  • Standard size: 200x400 mm.

  • It can be cut according to customers' requirements.

  • Thickness options range from 0.5 to 5.0 mm.

  • Adhesive backing can be applied as required.


Typical Applications:

  • Desktop computers, portable computers and servers

  • Laser equipment

  • Power supplies and UPS

  • Electronic communication equipment

  • Military electronic products

  • Motor and engine controllers

  • Energy conversion equipment

  • Signal converters

  • Mass storage devices

  • Vibration damping applications


Technical Parameters:

General Characteristics of ND-TP1400 Series
Product ModelND-TP1400Test Method
ColorGray Visual
Main ComponentsSilicone + Ceramic***
Thickness (mm)0.5-5.0ASTM D751
Density (g/cc)3.1g/cm3ASTM D297
Hardness (Shore 00)50-70ASTM D2240
Tensile Strength (psi)32ASTM D412

Temperature resistance range

-40   180***
Electrical Properties
Breakdown Voltage (V)

>2500(Thickness≤0.5mm")

>4500Thickness≥0.5mm"

ASTM D149
Dielectric Constant (1 MHz)4.48ASTM D150

Volume Resistivity (Ohm·cm)

9.8X1010ASTM D257
Fire Rating94 V0Equivalent UL
Thermal Conductivity
Thermal Conductivity Coefficient (W/m - K)14.0
ASTM D5470