Category：Thermal conductive silicone sheet
Performance and Characteristics：
Thermal conductivity: 2.0W/m·K
Medium compression ratio
With a certain degree of self-adhesion
High compression and resilience
Electrically insulated, compliant with ROHS requirements
Easy to construct
Product Configuration：
Standard size: 200x400 mm.
It can be cut according to customers' requirements.
Thickness options range from 0.3 to 12 mm.
Adhesive backing can be applied as required.
Typical Applications：
LED lighting products
Chassis, frames or other heat dissipation components
Power supplies and UPS (Uninterruptible Power Supplies)
Electronic communication devices
Military electronic products
High-speed and large-capacity storage devices
Energy conversion devices
Signal converters
RDRAM (Rambus Dynamic Random Access Memory) memory modules
Technical Parameters：
| General Characteristics of ND-TP200 Series | ||
| Product Model | ND-TP200 | Test Method |
| Color | Grey, Pink | Visual |
| Main Components | Silicone + Ceramic | *** |
| Thickness (mm) | 0.3-12 | ASTM D751 |
| Density (g/cc) | 2.1 | ASTM D297 |
| Hardness (Shore 00) | 30-40 | ASTM D2240 |
| Tensile Strength (psi) | 28 | ASTM D412 |
Service Temperature (°F/℃) | （-58 to 392 ° F）（-58 to 200 ℃） | *** |
| Electrical Properties | ||
| Breakdown Voltage (V) | >2500（Thickness≤0.5mm"） >4500（Thickness≥0.5mm"） | ASTM D149 |
| Dielectric Constant (1 MHz) | 4.9 | ASTM D150 |
Volume Resistivity (Ohm·cm) | 4.0X1013 | ASTM D257 |
| Fire Rating | 94 V0 | Equivalent UL |
| Thermal Conductivity | ||
| Thermal Conductivity Coefficient (W/m - K) | 2.0 | ASTM D5470 |
| Can be Glass Fiber Reinforced | It can be glass fiber reinforced at any thickness and is marked with the suffix "FG". | |
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