ND-SX80 Thermal Conductive Silicone Rubber Cloth

Category:Thermal conductive silicone film

The ND-SX80 is a thermal conductive silicone rubber cloth product made of thermal conductive silicone rubber with glass fiber as the reinforcing base material. It has both thermal conductive performance and high withstand voltage insulation performance. It is mainly applied between the heat-generating semiconductor devices and the heat dissipation base plates, playing the roles of heat conduction and insulation. The surface is flat and smooth, and it has good conformability on the surfaces of various metal and ceramic devices. Its high thermal conductivity allows it to achieve low interfacial thermal resistance performance under relatively low pressure, enabling efficient heat dissipation of the heat-generating components.
  • Details

Product Features:

  • Excellent thermal conductivity and low thermal resistance, with stable performance and reliable long-term use;

  • Bridging the tolerances in the structural process, reducing the requirements for the process tolerances of heat sinks and heat dissipation structural components;

  • It has a certain degree of flexibility and excellent insulation properties;

  • The surface is flat and smooth, and it has good conformability on the surfaces of various metal and ceramic devices;

  • The convenience of being reusable; 


Storage and Packaging Specifications:

To ensure the product maintains good quality, it should be stored in a dry environment at room temperature of 25°C. During the storage period, the environment should be kept clean and free of dust to prevent external contamination from affecting the electrical characteristics.

Packaging Specifications: Packed in rolls or sheets; 305mm * 50m (0.23-1.0MM), which can be customized according to customer requirements; Options include non-adhesive and single-sided self-adhesive. 


Application Methods:

It can be used in the following ways: automatic pasting and manual pasting. 


Application Areas:

Between the aluminum base plate and the heat sink;

For heat conduction between MOS transistors, transformers (or capacitors/PFC inductors) and the heat sink or the housing;

For heat conduction and dissipation between the motherboard ICs and the heat sink or the housing;

Applications in the automotive electronics industry (such as xenon lamp ballasts, audio systems, in-vehicle series products, etc.);

In microwave ovens/air conditioners (between the power IC of the fan motor and the housing)/induction cookers (between the thermistor and the heat sink). 


Performance Parameters:

Physical Properties ListUnitValueTesting Standard
Reinforced substrate
Glass fiberN/A
Color


Pink, gray, blueVision
Thermal conductivity coefficientW/m·K1.2±0.2ASTM D5470
thicknessmm0.23~1.0ASTM D374
dielectric constant@ 1MHz≧4.5ASTM D150
dielectric loss@ 1MHz≦0.1ASTM D150
hardnessShore A75±10ASTM D2240
breakdown voltagekV@0.3mm≧4.0ASTM D149
volume resistivityΩ ·cm≧1×1013ASTM D257
tensile strengthMPa≧6ASTM D412
thermal resistance@50psi( °C·in2/W)0.68ASTM D5470
flame retardant grade

V-1UL94
operating temperature-40~220N/A
environmental requirementsThis product complies with the control standards of RoHS2.0, Halogen and REACH.