ND-N100 Thermal Conductive Mud

Category:Conductive mud

The DN-N100 series thermal conductive mud series is used as a thermal conductive material in electronic devices, with excellent thermal conductivity. This product has a high viscosity and is harder than silicone grease. Users can shape it into various shapes according to their needs and fill it between the electronic components that need to be cooled and the heat sink/housing, making it in close contact, reducing thermal resistance, and quickly and effectively reducing the temperature of electronic components, thereby extending the service life of electronic products and improving their reliability. This product is easier to operate in the production, assembly, and maintenance processes of electronic products.
  • Details

Characteristics of ND-N100 Thermal Conductive Mud


High thermal conductivity, low thermal resistance


It has the same plasticity as plasticine and is very suitable for filling products with large thickness changes


Superior aging resistance performance


Low stress, low modulus, inherent viscosity,


Superior high temperature resistance, excellent weather and radiation resistance


Superior chemical and mechanical stability


Application of DN-N100 Thermal Conductive Mud


Widely used in fields such as LED, microprocessor, memory module, cache memory, sealed integrated chips, DC/DC converters, IGBT and other power modules, power semiconductors, solid-state relays, and bridge rectifiers.


Specific Performance Parameters Table of DN-N100 Series Thermal Conductive Mud


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The above data is from Dongguan Nuodi Insulation Material Co, The measurements taken by the Ltd laboratory are subject to final interpretation by the laboratory.


Packaging instructions


500g, 1kg, 2kg bagged or filled, 10kg, 20kg drum.